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Top Story
Intel brings new Atoms, chip sets to Computex Intel Corp. will
roll out at Computex in Taipei two new versions of its Atom processor
aimed at powering a new generation of low-cost computers as well as
high-end chip sets for more traditional desktops, targeting the rise
of high definition video.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6e60Em
Semiconductor News
How to make 3D ICs? Ask Aviza
How does one make a 3D device based on through-hole vias (TSVs)? Ask
Aviza Technology Inc. and Cubic Wafer Inc.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJen0PJWnJ0FrK0F7PV0Eb
VeriSilicon joins Power Forward Initiative ASIC and IP provider
VeriSilicon Holdings Co. Ltd. (Shanghai, China) has joined the Power
Forward Initiative (PFI) and plans to offer designs based on the
Common Power Format (CPF) to its ASIC customers.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJen0PJWnJ0FrK0F7PW0Ec
Novaled teams with Sumitomo, CDT on OLED Novaled AG, Cambridge
Display Technology Ltd. and Sumitomo Chemicals have agreed to
collaborate under a joint development agreement to investigate the
feasibility and benefits of new materials and Novaled PIN OLED
structures in P-OLED devices.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJen0PJWnJ0FrK0F7PX0Ed
IBM water cools 3D chips
Water-cooled 3-D chip stacks will enable IBM multicore processors to
increase interconnections by 100 times by stacking them in layers that
use water to cool as much as 180 watts per chip.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJen0PJWnJ0FrK0F7PY0Ee
Tensilica and SPIRIT DSP form strategic partnership
SPIRIT DSP and Tensilica Inc. have formed a strategic partnership and
can now deliver 18 optimized, high quality digital audio and voice
software packages that run on Tensilica's HiFi 2 Audio Engine, an
increasingly popular audio architecture for system-on-chip designs.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJcx0PJWnJ0FrK0F7ED0EG
Zoran waves, acquires French IC maker
Zoran Corp. has signed a definitive agreement to acquire France's Let
It Wave, a fabless semiconductor company, for $27.6 million in cash.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJcx0PJWnJ0FrK0F7EE0EH
Toshiba sees light for appliances in LEDs
Japan's Toshiba Corp. aims to more than triple sales at its lighting
operations in 12 years by phasing out incandescent lights and
switching to energy-saving
LEDs as power costs and concerns about greenhouse gas emissions rise.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJcx0PJWnJ0FrK0F7EF0EI
TSMC rolls 40-nm design flow
Paving the way for next-generation chips, Taiwan Semiconductor
Manufacturing Co. Ltd. (TSMC) today will roll out its latest design
methodology for IC production at the 40-nanometer node.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6e70En
Marvell enters SSD controller market Marvell Technology Group Ltd.
has entered into the solid-state controller market and separately
expanded its embedded processor line for consumer applications.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6e80Eo
Freescale set to close East Kilbride fab The future of
semiconductor manufacturing by Freescale at East Kilbride in Scotland,
and that of 750 of the 1000 people employed at the facility, took
another bleak turn as the company confirmed the focus of on-going
consultations is now very firmly on closure.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6fA0Ey
Business News
Spansion cut 500 jobs, expands in Asia
Hurt by ongoing losses and lackluster demand for NOR flash memory,
Spansion Inc. is eliminating approximately 500 positions worldwide.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJcx0PJWnJ0FrK0F7EG0EJ
ExpressCards prep for leap to 5 Gbits/s
The PCMCIA group that manages PC-card standards said it expects to
publish by early next year a version 2.0 standard supporting data
rates up to 5 Gbits/s, bringing it in line with the PCI Express 2.0
standard out now and the SuperSpeed USB 3.0 spec coming later this
year or early 2009.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJcx0PJWnJ0FrK0F7EH0EK
WiMax field trials set for Taiwan
Global Mobile Corp. of Taipei has announced plans to begin WiMax field
trials in Taiwan.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJcx0PJWnJ0FrK0F7EI0EL
DoD launches engineering research program The Pentagon has tapped
six engineering professors to be in its first class of faculty fellows
in a new science and engineering initiative.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6fB0Ez
Marvell enters SSD controller market Marvell Technology Group Ltd.
has entered into the solid-state controller market and separately
expanded its embedded processor line for consumer applications.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6e80Eo
Video-over-wireless startup raises $9 million LiveU Inc. (Fair
Lawn, New Jersey), a startup developer of technologies and products
for the transmission of live video over wireless networks, has raised
$9 million in a second round of investment.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6fC0E1
Technology News
Measuring quantum states could yield new chip-cooling scheme
Scientists have proposed using measurements of quantum states to
control temperature of quantum-bit processors as well as entrophy.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6fD0E2
Researchers claim advance towards low-cost GaN power devices
Researchers at IMEC and Aixtron AG have grown uniform AlGaN/GaN
heterostructures on 200mm silicon wafers. They suggest the
demonstration is a major advance towards fabricating low-cost GaN
power devices for high-efficiency/high-power systems beyond the
silicon limits.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6fE0E3
Design News
I/O planning, floor-plan synthesis go hand in hand
When chip-level I/O planning is done without consideration of the
package or the rest of the system, the result may be overly complex or
unroutable package designs that need multiple iterations to converge.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJcx0PJWnJ0FrK0F7EJ0EM
Project launched to provide coverage analysis tool
AdaCore, Open Wide, ENST and LIP6 with financial support from French
public funds, is setting up 'Project Coverage', an open source project
to produce a Free Software coverage analysis toolset together with
artifacts that allow the tools to be used by developers of
safety-critical and mission-critical projects, including systems that
need to be certified under safety standards such as DO-178B.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJcx0PJWnJ0FrK0F7EK0EN
Mindtree rolls Bluetooth automotive kit
Mindtree Ltd., based here, unveiled a Bluetooth automotive software
development kit addressing the dual challenges of interoperability
and dynamic specifications in automotive infotainment and personal
navigation devices.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJcx0PJWnJ0FrK0F7EL0EO
CSR trumpets tightest integrated wireless chip Wireless chip
specialist CSR plc (Cambridge, England) will start selling in volume
from the fourth quarter what it says is its, and the industry's, most
tightly integrated device to date.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6fF0E4
India's eInfochips unveils verification IP EInfochips Ltd. has
announced what is claims is first SystemVerilog verification IP that
complies with the Open Verification Methodology and the Advanced
Verification Methodology 3.0.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6fG0E5
This issue sponsored by: SDR 2008 Technical Conference and Product
Exposition
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Reconfigurable radio technology's mainstream acceptance in many
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Oct. 26-30 in Washington, D.C. Abstracts are due by March 21.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0FnAw0ED
~~~~~~~~~~~~ NOW HIRING ~~~~~~~~~~~~~~
Electronics Group Now Hiring 05/30/2008
T-Mobile seeking Messaging Systems Engineer in Bellevue, WA http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6P30EO
Protingent Staffing seeking Electrical Engineer in Mountain View, CA
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6P40EP
ISES, Inc. seeking Industrial Engineer in Bridgewater, NJ
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6P50EQ
Agilent Technologies seeking Senior Firmware Engineer in Shanghai, CN
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0Fw2v0E5
ITT Corporation seeking Senior Engineer 2 in Norfolk, VA
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F4Mv0EQ
For more great jobs, career-related news, features and services,
please visit TechInsights EETimesCareers.
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Latest from eeProduct Center
Bluetooth wireless chip integrates four radio functions
The single-chip BlueCore7 from CSR combines Bluetooth v2.1 + EDR,
Bluetooth low energy, enhanced GPS and FM transmit and receive
capabilities.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6fH0E6
Latest from eeProduct Center
Intel brings new Atoms, chip sets to Computex
Intel Corp. will roll out at Computex in Taipei two new versions of
its Atom processor aimed at powering a new generation of low-cost
computers as well as high-end chip sets for more traditional desktops,
targeting the rise of high definition video.
http://newsletter.eetimes.com/cgi-bin4/DM/y/eBJYU0PJWnJ0FrK0F6fI0E7
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